Himax Technologies, Inc. Announces TDDI Solution Design-Ins

Himax's "HiSIT(TM)" Full In-Cell Ready for Shipment While On-Cell Sales Continue to Gain Momentum


TAINAN, Taiwan, Aug. 18, 2015 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq:HIMX) ("Himax" or "Company"), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced design-ins with key panel makers and OEMs for its best-in-class single-chip touch and display driver integration ("TDDI") solution, HiSIT™. In addition to the existing shipment of out-cell and on-cell solutions, Himax's "HiSIT™" TDDI solution is ready for mass production and is expected to start shipping by the fourth quarter of 2015.

HiSIT™ could lower system level costs for panel makers and simplify supply chain management for OEMs. This single-chip solution will help handset makers deliver thinner, lighter, and sleeker designs with significantly enhanced performance. The industry is seeking cost effective and innovative display and touch solutions for smartphones and tablets, and HiSIT™ offers a state-of-the-art combination of Himax's highly recognized display driver and proven touch solution in a sophisticated structure that supports full in-cell touch displays for HD resolution smartphones and WXGA resolution tablets.

Jordan Wu, President and Chief Executive Officer of Himax Technologies, Inc., commented: "The industry is moving towards full in-cell panels driven by top-tier TFT-LCD makers seeking to introduce value-added innovations. Himax is one of the pioneers in offering one-chip TDDI solutions that requires significant integration complexity. We are excited about the projects awarded from these top tier customers, which demonstrates Himax's technological advancement and leading position in the latest full in-cell technology. We anticipate shipping our TDDI solution by the fourth quarter this year. Himax is in partnership with essentially all of the leading panel manufacturers for joint technological development of TDDI solutions, and we believe the Company will benefit from the rising TDDI trend, which should generate a more significant revenue contribution in 2016."

About Himax Technologies, Inc.

Himax Technologies, Inc. (HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies. Himax is a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, mobile phones, tablets, digital cameras, car navigation, and many other consumer electronics devices. Additionally, Himax designs and provides controllers for touch sensor displays, LCOS micro-displays used in palm-size projectors and head-mounted displays, LED driver ICs, power management ICs, scaler products for monitors and projectors, tailor-made video processing IC solutions and silicon IPs. The company also offers digital camera solutions, including CMOS image sensors and wafer level optics, which are used in a wide variety of applications such as mobile phone, tablet, laptop, TV, PC camera, automobile, security and medical devices. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs over 1,800 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan and the US. Himax has 2,650 patents granted and 648 patents pending approval worldwide as of June 30, 2015. Himax has retained its position as the leading display imaging processing semiconductor solution provider to consumer electronics brands worldwide.

http://www.himax.com.tw

Forward Looking Statements

Factors that could cause actual events or results to differ materially include, but not limited to, general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortages in supply of key components; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2014 filed with the SEC, as may be amended.



            

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