Dublin, Dec. 07, 2017 (GLOBE NEWSWIRE) -- The "System in Package Market by Packaging Technology, Package Type, Packaging Method, Device, Application - Global Forecast to 2023" report has been added to Research and Markets' offering.
The system in package market is expected to grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The growth of this market is propelled by the growing demand for miniaturization of electronic devices, impact of Internet of Things (IoT), and reduced time-to-market, and developments in the system in package ecosystem through organic and inorganic growth strategies such as product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships.
Among all the technologies in the system in package, the market for 3D IC is expected to grow at the highest CAGR between 2017 and 2023. The major factors driving the system in package market for 3D IC include the highest interconnect density and greater space efficiency than all other types of packaging technologies such as 2D IC and 2.5D IC. Moreover, leading semiconductor companies are focusing on R&D for the development of the 3D IC packaging technology to cater to this demand.
The market for FOWLP packaging method is expected to grow at a high rate between 2017 and 2023. The demand for FOWLP would be driven by the evolution of wireless communication networks. For instance, the 5G wireless communications technology is developing rapidly and is expected to start rolling out worldwide by 2020. For advanced high-performance communication applications, network infrastructure manufacturers need integration of various heterogeneous devices such as RF transceiver, baseband processor, and power management IC (PMIC) in a single unit, which, in turn, results in the increased demand for FOWLP packaging method.
Among various applications, the consumer electronics application accounted for the largest share of the overall system in package market based on the industry in 2016. The growth is attributed to the high adoption of system in package technology in smartphones and tablets because of their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. These are portable computing devices that encompass additional advanced features and higher connectivity than a regular feature phone, with many functions built in a single device. As a result, many ICs need to be incorporated into a single chip module for reducing the board space, cost, and the overall time to market. With all this development in the consumer electronics application, the demand for system in package would also rise.
APAC is expected to hold the largest share of the system in package market during the forecast period. This growth is mainly attributed to the broad scope of system in package technology in various consumer electronics applications, particularly in smartphones and tablets. In addition, the high population density in APAC, as well as the presence of major companies in this sector such as Samsung Electronics (South Korea), ASE Group (Taiwan), and many others, drives the growth of the system in package market in APAC. The key restraining factor for the growth of the system in package market is thermal-related issues caused by higher levels of integration.
Companies Mentioned
- Amkor Technology
- ASE Group
- Chipbond Technology
- Chipmos Technologies
- FATC
- Intel
- JCET
- Powertech Technology
- Samsung Electronics
- Spil
- Texas Instruments
- Unisem
- UTAC (Global A&T Electronics)
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
5 Market Overview
6 SiP Market, By Packaging Technology
7 SiP Market, By Package Type
8 SiP Market, By Packaging Method
9 SiP Market, By Device
10 SiP Market, By Application
11 SiP Market, By Geography
12 Competitive Landscape
13 Company Profiles
For more information about this report visit https://www.researchandmarkets.com/research/rlxxbl/system_in_package?w=12