Aurora, IL, March 28, 2018 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq: CCMP), the world’s leading supplier of chemical mechanical planarization (CMP) polishing slurries and the second largest CMP pads supplier to the semiconductor industry, and Fujimi Incorporated (TSE: 5384), a pioneer in the field of manufacturing synthetic precision abrasives, a leading supplier of silicon wafer lapping abrasives, and a supplier of polishing slurries, today announced plans to collaborate in the development of certain advanced IC CMP solutions for the semiconductor industry.
Cabot Microelectronics and Fujimi Incorporated believe that by working together they can leverage their respective expertise to anticipate and meet customer requirements for innovative IC CMP solutions for an increasing number of advanced semiconductor applications, including those for augmented reality, artificial intelligence, automotive, high performance computing and 5G wireless broadband technologies.
"We are excited to partner with Cabot Microelectronics to work to bring new technologies to an array of advanced logic and memory applications," said Keishi Seki, President and CEO of Fujimi Incorporated. “Our planned initiative continues our dedication to the development of breakthrough IC CMP products to solve our customers’ most challenging technical problems, and we look forward to the potential for building from this base going forward.”
“I am delighted with the opportunities this initial collaboration is designed to provide for our customers and respective companies,” said David Li, President and CEO of Cabot Microelectronics. “Fujimi Incorporated and Cabot Microelectronics are both leaders in materials development, with a track record of providing high quality, leading edge IC CMP solutions to our customers; together, I believe we are even better positioned to develop advanced IC CMP solutions for the semiconductor industry, which is experiencing unprecedented growth.”
ABOUT CABOT MICROELECTRONICS
Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, USA, is the world's leading supplier of CMP polishing slurries and second largest CMP pads supplier to the semiconductor industry. The company’s products play a critical role in the production of advanced semiconductor devices, helping to enable the manufacture of smaller, faster and more complex devices by its customers. The company's mission is to create value by delivering high-performing and innovative solutions that solve its customers’ challenges. The company has approximately 1,150 employees on a global basis. For more information about Cabot Microelectronics Corporation, visit www.cabotcmp.com or contact Colleen Mumford, Director of Investor Relations, at 630-499-2600.
ABOUT FUJIMI INCORPORATED
Fujimi Incorporated, headquartered in Kiyosu, Aichi Prefecture, Japan is a pioneer in the manufacturing of synthetic precision abrasives. With a long history of excellence in precision grading technologies, accumulated experience and extensive research and development capabilities, the Company expanded beyond abrasives for optical lenses to develop and deliver a variety of ultraprecision products sought by leading-edge high-tech industries. The company’s products include polishing abrasives for silicon wafers and other semiconductor substrates, various CMP products, and abrasives for computer hard disks. The company’s mission is to develop new, innovative technologies and applications with a commitment to environmental sustainability, thereby enabling the advancement of technology for the betterment of humanity. The company has approximately 830 employees on a global basis. For more information about Fujimi Incorporated, visit http://www.fujimiinc.co.jp/english.
SAFE HARBOR STATEMENT
This news release may include statements that constitute “forward looking statements” within the meaning of federal securities regulations. These forward-looking statements include statements related to: future sales and operating results; growth or contraction, and trends in the industry and markets in which the company participates; the company’s management; various economic or political factors and international or national events; regulatory or legislative activity, including the enactment of the Tax Cuts and Jobs Act in December 2017 in the United States; product performance; the generation, protection and acquisition of intellectual property, and litigation related to such intellectual property; new product introductions; development of new products, technologies and markets; the company’s supply chain; the financial conditions of the company’s customers; natural disasters; the acquisition of, investment in, or collaboration with other entities; uses and investment of the company’s cash balance, including dividends and share repurchases, which may be suspended, terminated or modified at any time for any reason by the company, based on a variety of factors; financing facilities and related debt, payment of principal and interest, and compliance with covenants and other terms; the company’s capital structure; the company’s current or future tax rate, including the effects of tax reform in the US; and the operation of facilities by Cabot Microelectronics Corporation. These forward-looking statements involve a number of risks, uncertainties, and other factors, including those described from time to time in Cabot Microelectronics’ filings with the SEC, that could cause actual results to differ materially from those described by these forward-looking statements. In particular, see "Risk Factors" in the company’s quarterly report on Form 10-Q for the quarter ended December 31, 2017 and in the company’s annual report on Form 10-K for the fiscal year ended September 30, 2017, both filed with the SEC. Cabot Microelectronics assumes no obligation to update this forward-looking information.