Dublin, July 25, 2018 (GLOBE NEWSWIRE) -- The "Apple iPhone X - MEMS Microphones Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.
For microphone integration in the iPhone X, Apple has chosen the market's top three microphone suppliers: Goertek, Knowles, and AAC Technologies.
The Apple iPhone X has four MEMS microphones: a front-facing top microphone, two front-facing bottom microphones, and a rear-facing top microphone. This layout is similar to previous iPhones, but the front-facing bottom-right microphone is now integrated in the speaker module. All four microphones share the same Apple-specific package dimensions, but with a different internal structure (number of substrate metal layers, embedded capacitance, ASIC, etc.).
In the iPhone X, we've observed changes to the microphones provided by Apple's three suppliers:
Goertek, which still relies on Infineon for die manufacturing, integrates Infineon's technology with a double backplate, delivering a differential MEMS microphone. For the ASIC, Goertek has considerably reduced the die area by around 40% compared to the previous die.
Knowles uses the same technologies as before, but one part has a new MEMS design and another part has an existing MEMS design.
AAC uses the same MEMS microphone die as Goertek, but with a different ASIC.
Infineon is a big winner. By providing ASIC and MEMS dies to all of Goertek's and AAC Technologies' products, it now possesses a large share of the MEMS microphone market.
Key Topics Covered:
Overview/Introduction
Company Profile and Supply Chain
iPhone X - Teardown
Goertek/Knowles/AAC Technologies
Physical Analysis
- Package
- Package view and dimensions
- Package opening
- Package cross-section
- ASIC Die
- View, dimensions and marking
- Dicing
- Delayering and process
- Cross-section
- MEMS Die
- View, dimensions and marking
- Dicing
- Membrane and backplate
- Anti-stiction bumps
- Cavity
- Cross-section
Manufacturing Process Flow
- ASIC Front-end Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
Physical Analysis Comparison
Goertek/Knowles/AAC Technologies - Cost Analysis
- Cost Analysis Overview
- Yield Hypotheses
- ASIC Front-end Cost
- ASIC Wafer and Die Cost
- MEMS Front-end Cost
- MEMS Wafer and Die Cost
- Back-end: Packaging Cost
- Microphone Component Cost
Goertek/Knowles/AAC Technologies - Estimated Sales Price
Manufacturing Cost Comparison
For more information about this report visit https://www.researchandmarkets.com/research/tnns88/complete_teardown?w=12