Applied Materials today introduced an enhanced version of the company’s Producer™ Black Diamond™ PECVD dielectric film. This new material enables chip scaling to 2nm and below, while offering increased mechanical strength to help take 3D logic and memory stacking to new heights.
Applied Materials today introduced an enhanced version of the company’s Producer™ Black Diamond™ PECVD dielectric film. This new material enables chip scaling to 2nm and below, while offering increased mechanical strength to help take 3D logic and memory stacking to new heights.