Applied Materials’ Latest Integrated Materials Solution™ Extends Copper Wiring to 2nm and Beyond
Applied Materials’ new Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD combines six different technologies in one high-vacuum system, including an industry-first combination of materials that enables chipmakers to scale copper wiring to the 2nm node and beyond.
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PNG
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Applied Materials, Inc.