Applied Materials is the largest supplier of technologies for heterogeneous integration (HI). The company’s newest solutions help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).
Applied Materials is the largest supplier of technologies for heterogeneous integration (HI). The company’s newest solutions help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs).