ATP Electronics Thermal Management Memory Solution

ATP Electronics Thermal Management Memory Solution

ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage, Customizable Thermal Management Solution Delivers Sustained Performance Improvements in Diverse High-Temp Scenarios

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JPEG

Source

ATP Electronics Taiwan Inc.

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