With the semiconductor industry’s first use of ruthenium in high-volume production, Applied Materials' new binary metal combination of ruthenium and cobalt (RuCo) enables copper chip wiring to be scaled to the 2nm node and beyond and reduces electrical line resistance by as much as 25 percent.
With the semiconductor industry’s first use of ruthenium in high-volume production, Applied Materials' new binary metal combination of ruthenium and cobalt (RuCo) enables copper chip wiring to be scaled to the 2nm node and beyond and reduces electrical line resistance by as much as 25 percent.