SAN JOSE, Calif. and HO CHI MINH CITY, Vietnam, April 04, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, has created a new scholarship program to recognize outstanding female STEM (science, technology, engineering, and mathematics) students with outstanding global citizenship. On March 9, 2018, eSilicon awarded seven scholarships in a ceremony at STEMCON 2018 Vietnam. These awards are sponsored by eSilicon and implemented through the USAID sponsored BUILD-IT (Building University-Industry Learning and Development through Innovation and Technology) public-private partnership, led by Arizona State University.
eSilicon supports engineering students around the globe in achieving their career goals. This scholarship program aims to nurture and develop the next generation of female engineering leadership in Vietnam, helping them fund their university tuition fees or engineering research projects. eSilicon also offered paid internships to three top-level winners who are in their final year of study with a potential for an employment offer to join its large engineering team at eSilicon Vietnam upon graduation.
eSilicon evaluated students in key areas in addition to academic excellence, including developing practical engineering project solutions, demonstrating leadership and exhibiting a passion to help others. The eSilicon team directly interviewed and selected the winners, with support for marketing, application and the award ceremony though partnership with Arizona State University, implementing partner for BUILD-IT. The award ceremony was held during STEMCON, which brings together education leaders, faculty and corporate partners to discuss and promote quality STEM education and public/private partnerships at the largest conference of its kind in Southeast Asia.
eSilicon Global Internships and Scholarships
Additional eSilicon scholarship and internship programs: Sunflower Mission Engineering & Technology Scholarship for Excellence (Vietnam) and FAST Academy paid internships (Romania and Italy).
About eSilicon
eSilicon is an independent provider of complex FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete, 2.5D/HBM2 and TCAM platforms for FinFET technology at 14/16/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.
About BUILD-IT
As the third major USAID award to ASU, the BUILD-IT public-private ecosystem is designed to produce graduates who can solve problems and engineer solutions and value for Vietnam’s social and economic development. BUILD-IT leverages the vast capabilities of the implementing partner Arizona State University, along with diverse government, industry, and academic partners linking technology and engineering higher education to the needs and capabilities of industry partners, building strategic leadership skills to advance university autonomy, program and instructional quality and formal lasting partnerships. Industry partner commitments throughout the life of the five-year project are anticipated to reach nearly $6M.
About ASU
Arizona State University has developed a new model for the American research university, creating an institution that is committed to access, excellence and impact. ASU measures itself by those it includes, not by those it excludes. As the prototype for a New American University, ASU pursues research that contributes to the public good, and ASU assumes major responsibility for the economic, social and cultural vitality of the communities that surround it. For three years in a row, ASU has been ranked the nation’s most innovative university by U.S. News & World Report.
About STEMCON
Arizona State University hosts the largest, longest running engineering education conference in Vietnam. The 2018 conference was the sixth year for bringing together Southeast Asia’s greatest minds and influencers in the STEM fields. The conference unites policy makers, corporate leaders and educational directors as well as students, teachers, and entrepreneurs poised to make an innovative change in the Southeast Asian STEM environment.
Collaborate. Differentiate. Win.™
eSilicon is a registered trademark, and the eSilicon logo and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
| Contacts: | |
| Sally Slemons | Susan Cain |
| eSilicon Corporation | Cain Communications |
| 408-635-6409 | 408-393-4794 |
| sslemons@esilicon.com | scain@caincom.com |
A photo accompanying this announcement is available at http://resource.globenewswire.com/Resource/Download/57c989fa-d899-434b-8e1d-4b4d3b51c0d0