Microsemi Awarded Contract for Silicon Carbide Avionics

Congress Appropriates $2 Million to Company for Advanced RF Communications


IRVINE, Calif., Oct. 8, 2009 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC) a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, announced today that Congress has appropriated $2 million to allow Microsemi's Power Products Group in Bend, Oregon, to develop critical silicon carbide-based components for data communications systems on new and upgraded Air Force platforms.

News of the Congressional funding came from Washington in an announcement by Oregon U.S. Senators Jeff Merkley and Ron Wyden of the passing of a defense appropriations bill late Tuesday night that includes Microsemi's on-going development of next generation silicon carbide RF components.

This commitment by the Air Force and Congress will further the development of SiC technology supporting future designs of lighter and more efficient jet fighter communications systems.

SiC brings several advantages in avionics applications, including increased reliability, extended battlespace coverage, point-of-use power conversion, and reduced size and cooling requirements. SiC plays a key role as battlefields become more networked and the demands for expanded bandwidth and high operation significantly increase.

According to James J. Peterson, Microsemi president, "Microsemi is committed to leading the development of silicon carbide components at our Bend operations that will enable advanced communications for both defense and commercial applications."

About Microsemi

Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.

The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning Congress appropriating $2 million to allow Microsemi's Power Products Group in Bend, Oregon, to develop critical silicon carbide-based components for data communications systems on new and upgraded Air Force platforms, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.



            

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