[Latest] Global Advanced Chip Packaging Market Size/Share

Austin, TX, USA, July 31, 2023 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D packaging, 3D packaging, fan-out wafer-level packaging (FOWLP), flip-chip packaging, system-in-package (SiP) solutions), By Packaging (Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)), By End-Use Industry (Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace and Defence), and By Region - Global Industry Overview, Statistical Data, Competitive Analysis, Share, Outlook, and Forecast 2023–2032” in its research database.

“According to the latest research study, the demand of global Advanced Chip Packaging Market size & share was valued at approximately USD 35.6 Billion in 2022 and is expected to reach USD 39.2 Billion in 2023 and is expected to reach a value of around USD 71.8 Billion by 2032, at a compound annual growth rate (CAGR) of about 8.2% during the forecast period 2023 to 2032.”

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Advanced Chip Packaging Market: Growth Factors and Dynamics

Increasing Demand for Miniaturization: The growing need for smaller, lighter, and more powerful electronic devices has driven the demand for advanced chip packaging solutions. These packaging technologies enable the integration of more functionalities into smaller form factors, supporting the trend of miniaturization in various industries.

Shift towards System Integration and Multi-Chip Solutions: As technology advances, electronic devices are increasingly embracing system integration and multi-chip solutions. Advanced chip packaging allows different chips and components to be combined in a single package, resulting in smaller devices with improved connectivity and easier assembly. This integration leads to compact and versatile devices that offer enhanced performance and functionality.

Rising Complexity of Semiconductor Devices: As semiconductor devices become more complex and advanced, traditional packaging methods may not meet the performance requirements. Advanced chip packaging techniques, such as 2.5D and 3D packaging, offer higher interconnect density and improved electrical performance, addressing the challenges posed by complex semiconductor designs.

Demand for Higher Data Transfer Rates: With the rise in data-intensive applications and high-speed connectivity, the demand for advanced chip packaging solutions with better signal integrity and thermal management has surged. Packaging technologies like flip-chip and wafer-level chip scale packaging (WLCSP) enable higher data transfer rates and efficient heat dissipation.

Focus on Energy Efficiency: Energy efficiency is a key consideration for modern electronic devices. Advanced chip packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, enable the integration of power management and heterogeneous components, enhancing energy efficiency and prolonging battery life.

Innovation and Technological Advancements: Continuous innovation in packaging materials, design techniques, and manufacturing processes is driving the advanced chip packaging market. New materials, such as fan-out molding compounds and organic substrates, and innovative manufacturing methods are contributing to improved performance, reliability, and cost-effectiveness of advanced chip packaging solutions.

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Advanced Chip Packaging Market: Partnership and Acquisitions

Qualcomm Technologies and Samsung Electronics (2020): In 2020, Qualcomm Technologies collaborated with Samsung Electronics to develop advanced chip packaging solutions for 5G smartphones. The partnership aimed to seamlessly integrate Qualcomm’s 5G modems with Samsung’s Exynos processors using innovative packaging techniques, enabling enhanced 5G connectivity in smartphones.

Amkor Technology and GlobalFoundries (2021): In 2021, Amkor Technology, Inc. partnered with GlobalFoundries to jointly develop and offer advanced packaging solutions for various semiconductor applications. This collaboration combined Amkor’s expertise in advanced packaging with GlobalFoundries’ manufacturing capabilities, enabling both companies to cater to the diverse packaging needs of their customers.

TSMC’s Acquisition of Invecus Limited (2020): In 2020, Taiwan Semiconductor Manufacturing Company Limited (TSMC) acquired Invecus Limited, a semiconductor materials supplier. This acquisition strengthened TSMC’s capability to access essential materials for advanced chip packaging, ensuring a steady supply chain for their semiconductor manufacturing operations.

SK Hynix’s Acquisition of Intel’s NAND Business (2021): In 2021, SK Hynix Inc. acquired Intel Corporation’s NAND memory and storage business. While not directly related to chip packaging, this acquisition allowed SK Hynix to enhance its semiconductor product lineup, including the integration of NAND flash chips into advanced chip packaging solutions for various applications.

Report Scope

Feature of the Report	Details
Market Size in 2023	USD 39.2 Billion
Projected Market Size in 2032	USD 71.8 Billion
Market Size in 2022	USD 35.6 Billion
CAGR Growth Rate	8.2% CAGR
Base Year	2022
Forecast Period	2023-2032
Key Segment	By Technology, Packaging, End-Use Industry and Region
Report Coverage	Revenue Estimation and Forecast, Company Profile, Competitive Landscape, Growth Factors and Recent Trends
Regional Scope	North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America
Buying Options	Request tailored purchasing options to fulfil your requirements for research.

(A free sample of the Advanced Chip Packaging report is available upon request; please contact us for more information.)

Our Free Sample Report Consists of the following:

Introduction, Overview, and in-depth industry analysis are all included in the 2023 updated report.
The COVID-19 Pandemic Outbreak Impact Analysis is included in the package.
About 220+ Pages Research Report (Including Recent Research)
Provide detailed chapter-by-chapter guidance on the Request.
Updated Regional Analysis with a Graphical Representation of Size, Share, and Trends for the Year 2023
Includes Tables and figures have been updated.
The most recent version of the report includes the Top Market Players, their Business Strategies, Sales Volume, and Revenue Analysis
Custom Market Insights (CMI) research methodology

(Please note that the sample of the Advanced Chip Packaging report has been modified to include the COVID-19 impact study prior to delivery.)

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Advanced Chip Packaging Market: COVID-19 Analysis

The COVID-19 pandemic has had a significant impact on the Advanced Chip Packaging Market, with the industry experiencing both positive and negative effects. Here are some of the key impacts:

Supply Chain Disruptions: The COVID-19 pandemic caused disruptions in the global supply chain, impacting the availability of raw materials, components, and equipment required for advanced chip packaging. This led to delays in production and increased costs for manufacturers.

Shift in Consumer Demand: With the pandemic’s impact on remote work, e-learning, and online entertainment, there was a surge in demand for electronic devices like laptops, tablets, and smartphones. This increased demand put additional pressure on the advanced chip packaging market to meet the growing need for high-performance chips.

Resilient Supply Chain: To recover, the advanced chip packaging industry focused on building a more resilient supply chain, diversifying sourcing locations, and securing critical components to reduce dependency on specific regions.

Accelerated Digital Transformation: The pandemic accelerated digital transformation, leading to increased demand for cloud services and data centers. Advanced chip packaging companies seized this opportunity to cater to the growing need for high-performance chips in cloud computing infrastructure.

Investment in Automation and AI: To enhance manufacturing efficiency and reduce workforce dependency, companies invested in automation and artificial intelligence technologies, streamlining production processes and mitigating the impact of labor shortages.

Focus on R&D and Innovation: Recovery efforts involved increased investment in research and development to create more advanced chip packaging solutions that meet the evolving demands of emerging technologies like 5G, AI, and IoT, ensuring continued growth in a post-pandemic world.

Adoption of Remote Collaboration Tools: The pandemic necessitated remote working and collaboration. Advanced chip packaging companies embraced digital tools and virtual collaboration platforms to ensure seamless communication between teams, enabling them to continue their work efficiently despite physical restrictions.

Focus on Healthcare and Medical Electronics: The pandemic highlighted the importance of healthcare and medical electronics. Advanced chip packaging companies redirected efforts towards developing chips for medical devices, diagnostic equipment, and telemedicine solutions, contributing to the healthcare industry’s recovery and growth.

In conclusion, the COVID-19 pandemic has had a mixed impact on the Advanced Chip Packaging Market, with some challenges and opportunities arising from the pandemic. Manufacturers and retailers need to remain agile and adapt to the changing market conditions to overcome these challenges and capitalize on new growth opportunities.

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Key questions answered in this report:

What is the size of the Advanced Chip Packaging market and what is its expected growth rate?
What are the primary driving factors that push the Advanced Chip Packaging market forward?
What are the Advanced Chip Packaging Industry's top companies?
What are the different categories that the Advanced Chip Packaging Market caters to?
What will be the fastest-growing segment or region?
In the value chain, what role do essential players play?
What is the procedure for getting a free copy of the Advanced Chip Packaging market sample report and company profiles?

Key Offerings:

Market Share, Size & Forecast by Revenue | 2023−2032
Market Dynamics – Growth Drivers, Restraints, Investment Opportunities, and Leading Trends
Market Segmentation – A detailed analysis by Types of Services, by End-User Services, and by regions
Competitive Landscape – Top Key Vendors and Other Prominent Vendors

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List of the prominent players in the Advanced Chip Packaging Market:

Intel Corporation
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Advanced Micro Devices Inc. (AMD)
Samsung Electronics Co. Ltd.
Amkor Technology, Inc.
ASE Group (Advanced Semiconductor Engineering Inc.)
Qualcomm Technologies Inc. (a subsidiary of Qualcomm Incorporated)
SK Hynix Inc.
Siliconware Precision Industries Co. Ltd. (SPIL)
Texas Instruments Incorporated (TI)
Others

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Browse the full “Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D packaging, 3D packaging, fan-out wafer-level packaging (FOWLP), flip-chip packaging, system-in-package (SiP) solutions), By Packaging (Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)), By End-Use Industry (Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace and Defence), and By Region - Global Industry Overview, Statistical Data, Competitive Analysis, Share, Outlook, and Forecast 2023–2032” Report at https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

Advanced Chip Packaging Market – Regional Analysis

The Advanced Chip Packaging Market is segmented into various regions, including North America, Europe, Asia-Pacific, and LAMEA. Here is a brief overview of each region:

North America: Trend – In North America, the Advanced Chip Packaging market is driven by a focus on technological advancements and innovation. The region has a strong presence of leading semiconductor companies and research institutions, fostering the development of cutting-edge chip packaging techniques and materials. Key players in this region include Intel Corporation, Qualcomm Technologies, Inc., Amkor Technology, Inc., and Texas Instruments Incorporated.

Europe: Trend – In Europe, the Advanced Chip Packaging market is characterized by a growing emphasis on sustainable and eco-friendly packaging solutions. The region is actively exploring green packaging materials and techniques to reduce environmental impact and meet the demands of environmentally conscious customers. Dominating Market Players – Leading players in the European market include ASML Holding N.V., Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These companies are at the forefront of providing advanced chip packaging solutions tailored to European industries’ sustainability goals.

LAMEA (Latin America, Middle East, and Africa): In the LAMEA region, the Advanced Chip Packaging market is influenced by increasing investments in infrastructure development and smart city initiatives. The demand for chip packaging solutions for IoT applications, telecommunication infrastructure, and industrial automation drives the market’s growth. Dominating Market Players – Prominent players in the LAMEA market include GlobalFoundries, ON Semiconductor Corporation, Tower Semiconductor Ltd., and South Microelectronics. These companies contribute to the region’s technological advancement through their diverse chip packaging offerings catering to various end-use industries.

Asia-Pacific: Trend – The Asia-Pacific region experiences a surge in the demand for advanced chip packaging solutions driven by rapid industrialization and the adoption of advanced technologies. The region’s focus on 5G deployment, IoT applications, and smart manufacturing fuels the demand for innovative chip packaging techniques. The major Prominent players in this region include such as Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung Electronics Co., Ltd., ASE Group (Advanced Semiconductor Engineering, Inc.)

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The Advanced Chip Packaging Market is segmented as follows:

By Technology

5D packaging, 3D packaging
fan-out wafer-level packaging (FOWLP)
flip-chip packaging
system-in-package (SiP) solutions

By Packaging

Ball Grid Array (BGA)
Quad Flat Package (QFP)
Chip Scale Package (CSP)
Wafer-Level Chip Scale Package (WLCSP)

By End-Use Industry

Electronics
Automotive
Telecommunications
Industrial
Healthcare
Aerospace and Defence

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By Region

North America

The U.S.
Canada
Mexico

Europe

France
The UK
Spain
Germany
Italy
Rest of Europe

Asia Pacific

China
Japan
India
Australia
South Korea
Rest of Asia Pacific

The Middle East & Africa

Saudi Arabia
UAE
Egypt
Kuwait
South Africa
Rest of the Middle East & Africa

Latin America

Brazil
Argentina
Rest of Latin American

This Advanced Chip Packaging Market Research/Analysis Report Contains Answers to the following Questions.

Which Trends Are Causing These Developments?
Who Are the Global Key Players in This Advanced Chip Packaging Market? What are Their Company Profile, Product Information, and Contact Information?
What Was the Global Market Status of the Advanced Chip Packaging Market? What Was the Capacity, Production Value, Cost and PROFIT of the Advanced Chip Packaging Market?
What Is the Current Market Status of the Advanced Chip Packaging Industry? What's Market Competition in This Industry, Both Company and Country Wise? What's Market Analysis of Advanced Chip Packaging Market by Considering Applications and Types?
What Are Projections of the Global Advanced Chip Packaging Industry Considering Capacity, Production and Production Value? What Will Be the Estimation of Cost and Profit? What Will Be Market Share, Supply and Consumption? What about imports and exports?
What Is Advanced Chip Packaging Market Chain Analysis by Upstream Raw Materials and Downstream Industry?
What Is the Economic Impact On Advanced Chip Packaging Industry? What are Global Macroeconomic Environment Analysis Results? What Are Global Macroeconomic Environment Development Trends?
What Are Market Dynamics of Advanced Chip Packaging Market? What Are Challenges and Opportunities?
What Should Be Entry Strategies, Countermeasures to Economic Impact, and Marketing Channels for Advanced Chip Packaging Industry?

Click Here to Access a Free Sample Report of the Global Advanced Chip Packaging Market @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

Reasons to Purchase Advanced Chip Packaging Market Report

Advanced Chip Packaging Market Report provides qualitative and quantitative analysis of the market based on segmentation involving economic and non-economic factors.
Advanced Chip Packaging Market report outlines market value (USD) data for each segment and sub-segment.
This report indicates the region and segment expected to witness the fastest growth and dominate the market.
Advanced Chip Packaging Market Analysis by geography highlights the consumption of the product/service in the region and indicates the factors affecting the market within each region.
The competitive landscape incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled.
Extensive company profiles comprising company overview, company insights, product benchmarking, and SWOT analysis for the major market players.
The Industry's current and future market outlook concerning recent developments (which involve growth opportunities and drivers as well as challenges and restraints of both emerging and developed regions.
Advanced Chip Packaging Market Includes in-depth market analysis from various perspectives through Porter's five forces analysis and provides insight into the market through Value Chain.

Reasons for the Research Report

The study provides a thorough overview of the global Advanced Chip Packaging market. Compare your performance to that of the market as a whole.

Aim to maintain competitiveness while innovations from established key players fuel market growth.

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What does the report include?

Drivers, restrictions, and opportunities are among the qualitative elements covered in the worldwide Advanced Chip Packaging market analysis.

The competitive environment of current and potential participants in the Advanced Chip Packaging market is covered in the report, as well as those companies' strategic product development ambitions.

According to the component, application, and industry vertical, this study analyzes the market qualitatively and quantitatively. Additionally, the report offers comparable data for the important regions.

For each segment mentioned above, actual market sizes and forecasts have been given.

Who should buy this report?

Participants and stakeholders worldwide Advanced Chip Packaging market should find this report useful. The research will be useful to all market participants in the Advanced Chip Packaging industry.
Managers in the Advanced Chip Packaging sector are interested in publishing up-to-date and projected data about the worldwide Advanced Chip Packaging market.
Governmental agencies, regulatory bodies, decision-makers, and organizations want to invest in Advanced Chip Packaging products' market trends.
Market insights are sought for by analysts, researchers, educators, strategy managers, and government organizations to develop plans.

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