SILTECTRA Prepares to Ramp Up Wafering Services Business Company set to make COLD SPLIT wafering technology available to semiconductor and materials manufacturers, and speed adoption of complex substrate materials, like silicon carbide DRESDEN, Germany,...

SILTECTRA Reports New Enabling and Cost-Of-Ownership Advantages for Cold Split Wafering Technology SAN FRANCISCO, Calif., July 09, 2018 (GLOBE NEWSWIRE) -- SEMICON West -- SILTECTRA GmbH, a Germany-based leader in advanced wafering technology solutions and services, today revealed new enabling...

SILTECTRA Fortifies Market Position by Adding New Patents to Global Intellectual Property Portfolio DRESDEN, Germany, May 09, 2018 (GLOBE NEWSWIRE) -- SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today announced that it has fortified its market position by...

SILTECTRA’s “Twinning” Breakthrough Promises to Vastly Reduce Wafering Costs for Manufacturers of Silicon Carbide-Based IC Devices DRESDEN, Germany, Feb. 26, 2018 (GLOBE NEWSWIRE) -- SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today reports that it has validated a breakthrough capability for...