Jeannine Serbanich, Promex
Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
December 04, 2024 09:00 ET | Promex Industries
Promex Industries and its QP Technologies division have named Jeannine Serbanich VP of Finance for the two companies.
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ZFlo Technologies and LOOT8, Inc. Announce Joint Venture to Revolutionize Package Security, Addressing a $30 Billion Annual Problem
September 25, 2024 09:15 ET | Gold Rock Holdings, Inc.
ZFlo Technologies and LOOT8, Inc. Announce Joint Venture to Revolutionize Package Security, Addressing a $30 Billion Annual Problem
Rosie Medina
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
July 29, 2024 09:00 ET | Promex Industries
Promex Industries and QP Technologies have announced a sales/marketing reorganization aimed at growing both companies’ core businesses.
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QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
October 03, 2022 08:00 ET | QP Technologies
BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its...
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QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
September 29, 2021 09:00 ET | QP Technologies
ESCONDIDO, Calif., Sept. 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new...
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Trurenu Poly Packaging by Glenroy® Approved for Nextrex® Recycling Program
September 28, 2021 09:05 ET | Trex Company, Inc.
MILWAUKEE, Sept. 28, 2021 (GLOBE NEWSWIRE) -- Glenroy, Inc., a leading producer of sustainable flexible packaging, has teamed with Trex Company, the world’s largest manufacturer of wood-alternative...
QP Technologies Expands Wire Bonding Capabilities
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
August 16, 2021 09:00 ET | QP Technologies
ESCONDIDO, Calif., Aug. 16, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has...
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QP Technologies™ Expands Interposer Design Capabilities
March 29, 2021 09:00 ET | QP Technologies
ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced...
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Quik-Pak Becomes QP Technologies™
March 11, 2021 09:00 ET | QP Technologies
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and...
An OmPP RF package from Quik-Pak
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
October 06, 2020 09:00 ET | Quik-Pak
ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages....