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Introducing Multi-Cure® 9037-F Encapsulant for Printed Circuit Board Assembly
July 08, 2020 08:00 ET | Dymax Corporation
TORRINGTON, Conn., July 08, 2020 (GLOBE NEWSWIRE) -- Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon...