Bookham Technology Announces the Demonstration of Linear Optical Amplification on Its ASOC Platform; The Power of Integration


ANAHEIM, Calif., April 2, 2002 (PRIMEZONE) -- OFC (Optical Fibre Conference) 2002. Bookham Technology plc (LSE:BHM) (Nasdaq:BKHM) has demonstrated the hybridization of a linear optical amplifier chip on its ASOC platform. This break-through brings together two powerful technologies: the world's most advanced platform for multiple active/passive optical integration and the first semiconductor WDM "amplifier on a chip." Applications for the technology include loss-less components, metro amplification and advanced optical switching and signal processing.

The demonstration was performed with a Linear Optical Amplifier (LOA) supplied by Genoa Corporation. Genoa's LOA is the first single-chip amplifier which can handle multiple wavelengths and data rates with low crosstalk, a critical requirement for WDM applications.

At its booth at OFC 2002, Bookham is demonstrating a typical metro configuration of power grooming, multiplexing and amplification - a combination which previously required multiple discrete devices but now promises to be achievable by low cost, small footprint integration.

Robert Green, VP of Business Development at Bookham Technology commented, "ASOC has demonstrated integration leadership through products such as single chip Mux-VOA and multiple active transceivers. The amplification function adds an extra dimension to the technology and opens new opportunities to develop low cost integrated sub-systems with our customers.

"Bookham's real world experience of active/passive hybridization and multi-function chips make them an interesting company for us to work with," said Genoa's Chief Executive, Rick Gold. He added, "this demonstration points the way to increasing applications of LOA's in highly integrated module solutions."

Bookham Technology (LSE:BHM) (Nasdaq:BKHM) designs, manufactures and markets integrated multi-functional active and passive optical components using high volume production methods. Using patented silicon-based ASOC, Gallium Arsenide and Indium Phosphide technologies, the company provides complete end-to-end networking solutions that offer higher performance and greater systems capability to communications network providers.

The company's product portfolio incorporates active and passive components and includes tunable lasers, 10Gb/s and 40Gb/s transmitters and receivers, EDFAs (erbium doped fiber amplifiers), electronic variable optical attenuators (EVOAs), multiplexers and demultiplexers, optical channel monitors and Mux-VOAs (multiplexer and variable optical attenuator on a single silicon chip).

The company, whose securities are traded on Nasdaq and the London Stock Exchange, is headquartered in the UK, with offices and manufacturing facilities in the US and UK, and has additional offices in France, Italy, Japan and China. The company employs approximately 850 people world-wide.

More information on Bookham Technology is available at www.bookham.com.

Bookham and ASOC are registered trademarks of Bookham Technology plc.



            

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