SCOTTS VALLEY, Calif., May 21, 2008 (PRIME NEWSWIRE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that they have received Richtek's Assembly Supplier of The Year Award for 2007. The award is based on a rating system which rates and monitors performance in areas such as on-time-delivery, cycle time, customer service, quality, competitiveness, responsiveness and technology.
During a recent ceremony at Richtek's annual dinner held at the Pariss Seafood Restaurant in Hsinchu Taiwan, the award was presented by Luke Hsieh, Richtek President and CEO to T.W. Hee, Carsem Suzhou General Manager. Also in attendance was Rick Flowers, Carsem's VP of Worldwide Sales and Marketing, Albert Law, Carsem's Director of Asian Sales and Max Lee, Carsem's Account Manager in Taiwan.
"Richtek would like to thank Carsem for their service and support which helped our business grow in 2007. We will continue to maintain a good relationship with Carsem to ensure a win-win partnership as we move forward," stated Raymond Wu, Richtek Director of Outsourcing.
"This is the second consecutive year we he have received this award from Richtek, and we are proud of this achievement. Richtek is a key customer and we are committed to strengthening our relationship as they continue to grow in the marketplace," stated Mr. Hee.
Mr. David Comley, Carsem Group Managing Director added, "To receive such an award for consecutive years is a great achievement for our Carsem Suzhou Team. This is a direct result of our commitment to working closely with our customers to ensure we are aligned with their product and service needs."
About Richtek
Founded in 1998, Richtek Technology Corporation is an analog IC design company, composed of experienced, professional, and innovative technologists. Since our start in 1998, Richtek not only deliver a new generation of cost-effective power management ICs, but also provide clients with customized system design-in services and support. Richtek is a "power partner". We play an active role in the integration of cutting-edge power management solutions into our clients' latest products. Clients increasingly rely on Richtek's proprietary design-in services in order to integrate advanced power management technologies into products facing tighter and tighter development schedules. These solutions have already made Richtek the world's largest supplier of power management ICs for desktop computer mainboards, as well as a leading provider of power management chips used in handsets, digital still cameras, network communications equipment, large-sized flat panel displays, notebooks, and much more. For more details, please visit www.Richtek.com
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.