Through Silicon Vias Have Landed -- Chipworks Analyzes the First Proven Commercial Implementation of TSV Technology From Toshiba

OTTAWA, ON--(Marketwire - September 15, 2008) - Chipworks (www.chipworks.com), the leader in reverse engineering analysis, today announced the availability of a full reverse engineering report on Toshiba's Through Silicon Via (TSV) technology. The analyzed device is an image sensor module, produced by Toshiba, and found inside a mobile phone.

According to market research company Yole Developpement, "3-D TSV wafer level encapsulation technologies have the potential to impact as much as 70% of the CMOS image sensor market for camera cell phones by 2012."

Toshiba's customers for this device are consumer products manufacturing companies who will benefit from a smaller footprint and a lower cost manufacturing process -- a benefit confirmed by the analysis Chipworks has completed to date.

"As predicted by Chipworks, image sensors have proven to be the first successful implementation of TSV technology on the market," said Gary Tomkins, VP Technical Intelligence, Chipworks. "However, manufacturers with complex packaging, or those needing to stack dice, will benefit from this technology including memory manufacturers such as Samsung, Hynix, and Micron, and image sensor manufacturers such as Aptina, Omnivision, and Sony."

Chipworks' analysis will deliver the level of detail required by engineering and senior management teams by taking them inside the process, using a combination of very high magnification TEM and SEM imaging, materials analysis, and engineering expertise.

Contents include:

--  Device identification and analysis
--  Process analysis of the die
--  TSV/3DIC process analysis (including liners and barriers)
    

This analysis will be used by clients to take the cost out of designs, with immediate returns of at least five times the revenue benefits, which can exceed 150 times the investment in reverse engineering analysis.

Companies interested in this report may contact Chipworks at insidetechnology@chipworks.com or via phone at 613-829-0414.

For a reverse engineering image of the Toshiba TSV shown in plan view, covered with the aluminum pad and with the aluminum pad removed, visit:

Image path: http://www.chipworks.com/press-release-images/Toshiba-TSV-planview.jpg

About Chipworks

Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company's ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world's largest semiconductor and microelectronics companies. These companies depend on Chipworks to secure, defend, and grow market share, and to save millions of dollars in royalty payments and product design costs, allowing them to earn millions by licensing patents, designing superior products, and launching new products faster. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation. Research and Development and Product Management rely on Chipworks for success in new product design and launch. Headquartered in Ottawa, Canada, Chipworks maintains offices in Japan, Korea, Taiwan, Israel, and Poland.

Contact Information: For more information contact: Phyllis Grabot Corridor Communications, Inc. 805.341.7269 phyllis@corridorcomms.com