Global 3D IC Market will reach USD 10.90 billion by 2022: Zion Market Research

According to the report, global 3D IC market was valued at around USD 4.04 billion in 2016 and is expected to generate revenue of USD 10.90 billion by end of 2022, growing at a CAGR of slightly above 18.0% between 2017 and 2022.


Sarasota, FL, April 03, 2017 (GLOBE NEWSWIRE) -- Zion Market Research has published a new report titled “3D IC Market (LED, Memories, MEMS, Sensor, Logic and Others) by Substrate type (Silicon On Insulator and Bulk Silicon) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2016 – 2022”. According to the report, global 3D IC market was valued at around USD 4.04 billion in 2016 and is expected to generate revenue of USD 10.90 billion by end of 2022, growing at a CAGR of slightly above 18.0% between 2017 and 2022.  

Among different product, 3D IC market was dominated by memories and MEMS & sensor segment and is expected to retain its dominance in the global market over the estimated period. LED is another key outlet for this market and is expected to grow at a moderate rate due to rising adoption of LED products as it saves power consumption and provides efficiency.

Browse through 18 Market Tables and 27 Figures spread through 110 Pages and in-depth TOC on “Global 3D IC Market Forecast Report, 2016 – 2022”.

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Based on application, the global 3D IC market is segmented into information and communication technology, military, consumer electronics and others. Information and communication technology segment held the largest market share for the 3D IC and accounted for around 26% market share of the total market in 2016. It is followed by consumer electronics and military segments. ICT is also expected to continue the trend in the next few years due to the high adoption rate of 3D IC integration technology. 3D IC market is segmented depending on the substrate used as silicon on insulator (SOI) and bulk silicon. Silicon on insulator (SOI) was the major segment of 3D IC and accounted for largest share of the global demand in 2016. Bulk silicon segment is expected to show moderate growth over the forecast period. 

Demand for consumer electronics and ICT are expected to drive the 3D IC market over the forecast period. Furthermore, increasing number of portable devices such as smartphone, tablets or laptops are some of the major factors to drive adoption of 3D ICs. Growing high-end computing market and rising need of 3D ICs in industries such as military & aerospace, and servers & data centers sector are also driving the growth of 3D ICs market. 

Browse the full "3D IC Market (LED, Memories, MEMS, Sensor, Logic and Others) by Substrate type (Silicon On Insulator and Bulk Silicon) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis, Size, Share, Growth, Segment, Trends and Forecast, 2016 – 2022" report at https://www.zionmarketresearch.com/report/3d-ic-market

Asia Pacific is the largest regional markets in the global 3D IC market and is expected to retain its dominance owing to significant demand from consumer electronics industries. It is one of the fastest growing regional markets for 3D IC due to growing economies in the region such as China, Japan, South Korea, and India among others. Asia Pacific is expected to have significant growth during the years to come owing to strong demand for smartphones, tablets and other mobile devices in the region.

Asia Pacific was followed by North America and Europe in 2016. North America is expected to have significant growth during the years to come owing to the technological advancement in 3D IC technology. U.S. is the key region in North America and plays a major role in the development of the future 3D IC industry. 3D IC market in North America is predicted to be mainly driven by demand from the U.S. and Canada. 3D IC market is mainly driven by the rising use of consumer electronic devices, rising technological advances, and growing market penetration in developing countries. 

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Europe is expected to show moderate growth during the forecast period due to technological advancement and rising consumer goods industry.  The considerable economic growth of countries such the UK, the Netherlands, Germany, and France drives the consumer electronics market and is likely to remain a determinant factor for the 3D IC market’s growth in the next few years. As compared to the U.S., Europe has a less efficient ICT growth model and lags in terms of private expenditure on R&D in ICT services. Latin America, Middle East, and Africa are likely to have considerable growth for 3D IC market during the estimated five years.  

Some of the key players in the global 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, United Microelectronics Corporation, STMicroelectronics and amongst others. 

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This report segments global 3D IC market as follows:
 
Global 3D IC Market:  Product Segment Analysis

  • LED
  • Memories
  • MEMS
  • Sensor
  • Logic
  • Others

Global 3D IC Market:  Substrate Segment Analysis

  • Silicon on Insulator (SOI)
  • Bulk Silicon

Global 3D IC Market:  Application Segment Analysis

  • Information and Communication Technology
  • Military
  • Consumer Electronics
  • Others

Global 3D IC Market: Regional Segment Analysis

  • North America
    • U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • The Middle East and Africa

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