Hyderabad, Aug. 11, 2023 (GLOBE NEWSWIRE) -- According to a new market research report titled "Outsourced Semiconductor Assembly and Test Services (OSAT) Market Report (2023-2028)," the market is estimated at USD 41.10 billion in 2023. It is expected to register a CAGR of 9.15% during the forecast period.
Outsourced Semiconductor Assembly and Test Service providers offer semiconductor assembly, packaging, and testing services for integrated circuits. They play a vital role in bridging the gap between semiconductor design and availability. The semiconductor industry is growing with a focus on miniaturization and efficiency. Outsourcing is a significant driver in the semiconductor industry, including FABs and OSATs. Applications like AI and 5G are driving advancements in packaging platforms, leading to collaboration with OSAT vendors.
Report Summary:
| Report Attribute | Details |
| Market Size (2023) | USD 41.10 billion |
| Market Size (2028) | USD 63.67 billion |
| CAGR (2023-2028) | 9.15% |
| Study Period | 2018-2028 |
| Fastest Growing Market | Asia-Pacific |
| Largest Market | Asia-Pacific |
| Forecast Units | Value (USD billion) |
| Report Scope | Market Dynamics, Revenue Forecast and Segmentation, Competitive Landscape and Recent Developments, Market Growth, Future Opportunities, and Trends |
| Key Market Drivers | Growth of the semiconductor industry. |
| Applications like AI and 5G. |
Who are the Top Companies in the Global OSAT Market?
The intensity of competitive rivalry in the market is moderate, and it is expected to grow. With the growing consolidation, technological advancement, and geopolitical scenarios, the market has been witnessing fluctuation. New competitors in the packaging and assembly space can provide OEMs with a one-stop solution.
The significant players in the global OSAT market are,
- ASE Group
- Amkor Technology Inc.
- Powertech Technology Inc.
- ChipMOS Technologies Inc.
- King Yuan Electronics Co. Ltd
- Formosa Advanced Technologies Co. Ltd
- Jiangsu Changjiang Electronics Technology Co. Ltd
- UTAC Holdings Ltd
- Lingsen Precision Industries Ltd
- Tongfu Microelectronics Co.
- Chipbond Technology Corporation
- Hana Micron Inc.
- Integrated Micro-electronics Inc.
- Tianshui Huatian Technology Co. Ltd
Other Reports That Might Be of Your Interest:
- Semiconductor Packaging Market Report - The semiconductor packaging market size is estimated at USD 95.40 billion in 2023. It is expected to reach USD 129.60 billion by 2028, at a CAGR of 6.32% during the forecast period (2023-2028).
- 2.5D & 3D Semiconductor Packaging Market Report - The 2.5D & 3D semiconductor packaging market size is expected to grow from USD 8.77 billion in 2023 to USD 16.17 billion by 2028, at a CAGR of 13.03% during the forecast period (2023-2028).
Key Highlights from the Global OSAT Market Report:
Growing Demand for Semiconductors in the Automotive Industry
- The automotive industry is a significant driver and opportunity for semiconductor and OSAT vendors. Semiconductors are essential for hardware in electric, hybrid, autonomous, and alternate-fuel vehicles.
- The semiconductor shortage in 2021-2022 highlighted the automotive industry's dependency on semiconductor chips.
- Increasing semiconductor products per vehicle and trends like autonomous and electric vehicles are creating more potential for the growth of the market.
United States to Lead the Market
- The United States is a significant market for the OSAT industry due to high investments, technological advancements, and innovation.
- Despite China's dominance in the OSAT and semiconductor market, the United States holds a strong position with a substantial number of technology patents.
- US innovation in the OSAT market has also attracted Asian vendors to the country. The impact of the US-China trade war on US fab equipment vendors is minimal.
What are the Latest Developments in the Global OSAT Market?
- In July 2022, Jiangsu Changjiang Electronics Technology Co. Ltd (JCET) started the construction of a new high-end manufacturing base in Jiangyin.
- In June 2022, UTAC Holdings Ltd announced a new cost-effective, next-generation test system solution for CMOS image sensors.
Mordor Intelligence has Segmented the Global OSAT Market Based on Service Type, Type of Packaging, Application, and Geography.
- By Service Type (Market Size and Forecast based on Value (USD billion), 2018-2028)
- Packaging
- Testing
- By Type of Packaging (Market Size and Forecast based on Value (USD billion), 2018-2028)
- Ball Grid Array (BGA) Packaging
- Chip-scale Packaging (CSP)
- Stacked Die Packaging
- Multi-chip Packaging
- Quad Flat and Dual-inline Packaging
- By Application (Market Size and Forecast based on Value (USD billion), 2018-2028)
- Communication
- Consumer Electronics
- Automotive
- Computing and Networking
- Industrial
- Other Applications
- By Geography (Market Size and Forecast based on Value (USD billion), 2018-2028)
- United States
- China
- Taiwan
- South Korea
- Malaysia
- Singapore
- Japan
- Rest of the World
In a nutshell, the Mordor Intelligence market research report is a must-read for start-ups, industry players, investors, researchers, consultants, business strategists, and all those who are looking to understand this industry. Get a glance at the Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market Report (2023-2028).
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About Mordor Intelligence:
Mordor Intelligence is a market intelligence and advisory firm. At Mordor Intelligence, we believe in predicting butterfly effects that have the potential to change or significantly impact market dynamics.
Our market research reports are comprehensive and provide exclusive data, facts and figures, trends, and the competitive landscape of the industry.
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