Axus Capstone CS200-ia
Axus Technology Receives Orders for Innovative Capstone® CMP System from World’s Top SiC Device Makers
08 juil. 2024 08h55 HE | Axus Technology
Axus Technology is seeing orders from the top SiC makers around the world for its flexible, innovative Capstone CS200 CMP platform.
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Silicon on Insulator Market revenue to hit USD 10 Billion by 2036, says Research Nester
28 nov. 2023 05h30 HE | Research Nester
New York, Nov. 28, 2023 (GLOBE NEWSWIRE) -- The global silicon on insulator (SOI) market size is predicted to grow at a CAGR of over ~14.6% from 2024 to 2036. The market is projected to garner a...
STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology
27 mai 2014 16h00 HE | STATS ChipPAC
SINGAPORE--28 MAY 2014, UNITED STATES--(Marketwired - May 27, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
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Boston Semi Equipment Purchases Japanese Fab
27 nov. 2012 08h00 HE | Boston Semi Equipment, LLC
BURLINGTON, MA--(Marketwire - Nov 27, 2012) - Boston Semi Equipment, LLC announced the purchase of a complete 200mm CMOS process fab tool set. The fab tool package is comprised of over 500 tools...