STATS ChipPAC Ranked in Top 10 Semiconductor Manufacturing Companies by the IEEE for Its Patent Innovations
07 janv. 2013 16h00 HE
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STATS ChipPAC
SINGAPORE -- 8 JANUARY 2013, UNITED STATES--(Marketwire - Jan 7, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading provider of advanced semiconductor...
STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic
05 déc. 2012 16h00 HE
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STATS ChipPAC
SINGAPORE -- 6 DECEMBER 2012, UNITED STATES--(Marketwire - Dec 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
05 nov. 2012 16h00 HE
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STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Advances Through Silicon Via Capabilities With the Qualification of 300mm Mid-End Processing and Low Volume Manufacturing
27 août 2012 16h00 HE
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STATS ChipPAC
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire - Aug 27, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Announces Volume Manufacturing of fcCuBE(TM) Technology and Expanded Processing Capability for This Advanced Flip Chip Packaging Solution
08 juil. 2012 19h30 HE
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STATS ChipPAC
SINGAPORE--09/07/2012, UNITED STATES--(Marketwire - Jul 8, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
11 avr. 2012 11h55 HE
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STATS ChipPAC
SINGAPORE--11/04/2012, UNITED STATES--(Marketwire - Apr 11, 2012) - STATS ChipPAC Ltd. has been recognized as one of 19 companies receiving Intel Corporation's Preferred Quality Supplier (PQS)...
STATS ChipPAC's Scalable 3D eWLB Solutions Deliver Performance, Height and Cost Advantages Over Substrate-Based Package-on-Package Technology
06 mars 2012 08h30 HE
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STATS ChipPAC
SINGAPORE--06/03/2012, UNITED STATES--(Marketwire - Mar 6, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC's Next-Generation Fan-Out Wafer Level Technology Platform Scales Packaging Solutions for Broader Range of Advanced Applications
05 oct. 2011 09h30 HE
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STATS ChipPAC
SINGAPORE--05/10/2011, UNITED STATES--(Marketwire - Oct 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Receives Intel's Preferred Quality Supplier Award
19 avr. 2011 12h45 HE
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STATS ChipPAC
SINGAPORE -- 4/20/2011, UNITED STATES--(Marketwire - Apr 19, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP) has been recognised to receive Intel Corporation's Preferred Quality...
STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing
18 avr. 2011 16h00 HE
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STATS ChipPAC
SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...