ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics เปิดตัว Industrial 176-Layer PCIe® Gen 4 x4 M.2, U.2 SSD ที่นำเสนอประสิทธิภาพ R/W ที่ยอดเยี่ยมพร้อมความจุสูงสุด 7.68 TB
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics ผู้นำระดับโลกด้านโซลูชั่นการจัดเก็บข้อมูลและหน่วยความจำเฉพาะทาง เปิดตัวอุปกรณ์จัดเก็บข้อมูล N600 Series M.2 2280 และ U.2 solid...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics Meluncurkan SSD U.2 PCIe® Gen 4 x4 M.2 Industri 176-Layer yang Menawarkan Performa R/W yang Luar Biasa, dengan Kapasitas Tertinggi 7,68 TB
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, pemimpin global dalam solusi penyimpanan dan memori khusus, memperkenalkan solid state drive (SSD) berkecepatan tinggi Seri...
ATP_Gen 4 M.2 2280 NVMe_pic3
華騰國際科技發表工規176層 PCIe Gen 4x4 M.2與 U.2 系列固態硬碟, 提供高效讀/寫效能,7.68 TB 高容量記憶體產品
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
台灣台北, June 28, 2023 (GLOBE NEWSWIRE) -- 華騰國際科技(ATP Electronics) 為全球專注於儲存記憶體的領導廠商,推出最新高速N601 系列M.2 2280及U.2 固態硬碟(Solid State Drive, SSDs),與第四代 PCIe 介面相競速,支援NVMe 讀寫介面。新型華騰國際科技PCIe第四代固態硬碟,資料速度為16...
Global DRAM Module and Components Market
DRAM Module and Component Market by Type, End-user Industries, Memory and Geography - Global Forecast to 2027
09 mai 2022 07h03 HE | Research and Markets
Dublin, May 09, 2022 (GLOBE NEWSWIRE) -- The "DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer...
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
18 mars 2022 11h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 18, 2022 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest line of M.2 2280 NVMe solid state drives...
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Flash and XPoint Memory Applications and Market Forecasts to 2026 - End-use Markets, Shipments, Market Shares by Vendor, and More
30 sept. 2021 05h23 HE | Research and Markets
Dublin, Sept. 30, 2021 (GLOBE NEWSWIRE) -- The "Flash and XPoint Memory Applications and Markets: 2019-2026" report has been added to ResearchAndMarkets.com's offering. Flash and XPoint memory...
ATP Electronics Thermal Management Memory Solution
ATP華騰國際發表高容量儲存記憶體 3.84及8 TB銅箔與鰭狀散熱片式NVMe M.2/U.2 固態硬碟
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
台灣台北, March 29, 2021 (GLOBE NEWSWIRE) -- 專注於儲存與記體體解決方案的領導廠商華騰國際科技(ATP Electronics)新發表客製化熱管理NVMe快閃記憶體解決方案。運用硬體與韌體配置,強化記憶體熱管理解決方案,特別針對NVMe介面的固態硬碟(Solid State Drives,...
ATP Electronics Thermal Management Memory Solution
ATP bietet NVMe M.2 / U.2 SSDs für Hochtemperaturapplikationen
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEH, Taiwan, March 29, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, ein führender Anbieter von spezialisierten Speicherlösungen, stellt neue NVMe-Flash-Speicherlösungen mit adaptivem Wärmemanagement...
ATP Electronics Thermal Management Memory Solution
ATP présente le dissipateur thermique/tampon thermique à ailettes et feuille de cuivre pour les cartes SSD NVMe M.2/U.2 offrant jusqu'à 3,84/8 To de stockage
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 29 mars 2021 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions spécialisées de stockage et de mémoire, a annoncé le lancement de ses nouvelles solutions de...
ATP Electronics Thermal Management Memory Solution
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with...