Introducing Multi-Cure® 9037-F Encapsulant for Printed Circuit Board Assembly
08 juil. 2020 08h00 HE
|
Dymax Corporation
TORRINGTON, Conn., July 08, 2020 (GLOBE NEWSWIRE) -- Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon...