WALLINGFORD, Conn., July 23, 2003 -- Northrop Grumman Corporation (NYSE:NOC) today announced that Michael P. Driscoll, president of Winchester Electronics, a business unit of its Component Technologies sector, has been appointed to the Executive Council of the International Engineering Consortium (IEC). The IEC is a nonprofit organization dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities.
As a member of the Council, Driscoll's role includes acting as liaison between industry and academia, and helping to develop programs and initiatives for companies and universities east of the Mississippi. Among its many functions, the IEC, whose members include a vast cross-section of engineers, managers, and executives, conducts industry/university programs that have a substantial impact on curricula, as well as conducting research and developing publications, conferences, and technological exhibits that address major opportunities and challenges of the new millennium. It has been credited with stimulating the rapid growth of the electronics industry through the development of innovative educational research and service programs. "It's a great honor to be asked to serve on IEC's Executive Council," said Driscoll. "I am looking forward to contributing to its extraordinary legacy in education and industry."
"Through our partnership with academia and industry, the IEC provides quality continuing education, research, and service programs for the international information industry," said John Janowiak, IEC senior director. "Mr. Driscoll's leadership in the industry and his record of management success make him a valuable addition to our leadership team."
Since becoming Winchester's president in 2000, Driscoll has been the principal architect in re-engineering Winchester from a connector manufacturer to a leader in the interconnect technology marketplace focused on high-bandwidth channels in copper. The company's groundbreaking SIP1000 I-Platform(tm) passive interconnect technology was recently used to demonstrate 10Gbps serial data transmission in a backplane environment at the Optical Internetworking Forum (OIF) Physical and Link Layer at SUPERCOMM 2003 in Atlanta, Georgia.
Winchester Electronics is a premier provider of high-speed, high-bandwidth interconnect products, including board-to-board connectors, RF connectors, cable assemblies, and power interconnects to the telecommunications, electronics, and information technology industries. Headquartered in Wallingford, Conn., Winchester supports the specific needs of its customers globally with technical Centers of Excellence in Connecticut, Mexico, China, and Malaysia.
Northrop Grumman's Component Technologies sector is a world leader in the design, development and manufacture of high performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Headquartered in Iselin, N.J., Component Technologies is comprised of seven business units which includes Interconnect Technologies, Kester(r), Life Support, Poly-Scientific, Precision Products, and Winchester Electronics. The sector has over 3,000 employees, with technical sales offices in 28 countries and operations in 18 countries.