CORRECTED ANNOUNCEMENT: ASPOCOMP TO ACQUIRE ITS CHINESE JOINT VENTURE; INVESTMENT AND SCHEDULE IN INDIA ADJUSTED

ASPOCOMP GROUP OYJ   COMPANY ANNOUNCEMENT  March 15, 2007 at 6:15 PM

ASPOCOMP TO ACQUIRE ITS CHINESE JOINT VENTURE; INVESTMENT AND
SCHEDULE IN INDIA ADJUSTED

The Board of Aspocomp Group Oyj has today resolved to acquire the 49
percent minority interest in ACP Electronics Ltd, the Aspocomp's
Suzhou, China based joint venture, from the Group's Taiwanese partner
Chin-Poon Holdings. The net purchase price is EUR 37.8 million. The
acquisition agreements will be signed on March 16, 2007 and according
to estimates, the acquisition will be finalized in March. It will
have an immediate positive impact on Aspocomp's financial result. The
gross transaction price of EUR 44.6 million will be reduced by
Chin-Poon's equipment purchase from ACP Electronics, valued at EUR
6.8 million. Since the equipment is not suitable for HDI technology
production, Aspocomp is unable to use it.

The transaction is planned to be financed with a EUR 40 million
market-based loan granted by Standard Chartered Bank Hongkong. As
part of the financing arrangement and based on the authorization
granted by the Extraordinary General Meeting on January 19, 2007,
Aspocomp will issue 4 million warrants that entitle the bank to
subscribe for a maximum of 4 million shares in Aspocomp. The exercise
price of the warrants will correspond to the market price of Aspocomp
shares at the time of the transaction. The company will issue a
separate bulletin on the financial arrangements and warrants terms."Acquisition of the entire share capital of ACP Electronics allows
Aspocomp to fully benefit from the plant's profitability and cash
flow and enables us to serve our global customers more efficiently.
Our aim is to increase the demanding technology HDI printed circuit
board (PCB) production capacity in China. Therefore, we plan to
upgrade the plant facility that will be vacated by Chin-Poon into a
HDI PCB plant during 2008", says CEO Maija-Liisa Friman. The same
premises also house another plant that started HDI PCB production
already in 2001. The plant's production capacity has since been
tripled to 40 million PCBs per year. The total added HDI PCB capacity
of ACP Electronics is estimated to amount to about 78 million units
in 2008.

As another part of the company's investment program, Aspocomp
continues building its new HDI PCB plant in Chennai, India. According
to new estimates, the investment will amount to about EUR 100
million, of which about EUR 80 million is earmarked for building and
machinery and EUR 20 million for working capital, interest and
start-up costs.

Planning, process definitions and bidding contests for the building
and machinery of the plant in India have been concluded and the
authority approvals required for plant construction have been
granted. The project is expected to be delayed by a few months due to
longer than expected authority approval processes and planning of the
facility and its waste treatment phases. Trial production is
therefore anticipated to start in early 2008 and full production in
the first half of 2008.

Aspocomp also considers strengthening its equity in the near future
by launching a rights issue ranging from EUR 20 to 25 million. The
company published a related bulletin on February 15, 2007.

Aspocomp is currently negotiating for long-term loans to partly
finance the investment in India. The duration of the negotiations
cannot currently be estimated and the company cannot guarantee that
they will result in an agreement.

The total investments in China and India after the acquisition of the
minority interest in ACP Electronics are estimated at about EUR 130
million. The investments are a vital part of Aspocomp's aggressive
growth strategy. The company focuses increasingly on technologically
more demanding HDI PCBs and seeks growth by escalating investments
particularly in Asia, the fastest growing HDI PCB market.

For further information, please contact Maija-Liisa Friman, CEO,
tel. +358 9 7597 0711.

ASPOCOMP GROUP OYJ



Maija-Liisa Friman
President and CEO


Aspocomp: Innovative interconnection solutions for the electronics
industry

The Aspocomp Group offers and develops innovative interconnection
solutions for the electronics industry in close cooperation with its
customers. We are strongly positioned as a supplier of mobile data
terminal equipment components and aim to further bolster our position
as a supplier to the automotive industry and data communications
networks. We offer our global customers a fast road to mass
production through flexible and cost-effective adaptation of new
technologies.

The Aspocomp Group's production facilities are located close to its
customers in Finland, China, and Thailand. In 2006, the Group's net
sales stood at EUR 149 million and it had about 3,350 employees.


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