Contact Information: Singapore Contact: Tham Kah Locke Tel: (65) 6824 7635 Fax: (65) 6720 7826 email: Email Contact US Contacts: Lisa Lavin Marcom Manager Tel: (208) 939 3104 Fax: (208) 939 4817 email: Email Contact The Ruth Group David Pasquale Executive Vice President Tel: (646) 536 7006 email: Email Contact
STATS ChipPAC Ltd. Schedules First Quarter 2007 Results Conference Call
| Source: STATS ChipPAC
UNITED STATES -- (MARKET WIRE) -- April 20, 2007 --SINGAPORE -- 4/20/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (NASDAQ : STTS ) and (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced it will hold a conference call with investors and
analysts on Thursday, April 26, 2007 at 8 a.m. in Singapore to discuss
results for the Company's first quarter 2007. This will be 8 p.m. in New
York on Wednesday, April 25, 2007.
The news release announcing the first quarter 2007 results will be
disseminated on April 25, 2007 after the Nasdaq stock market closes.
The dial-in number for the live audio call beginning at 8 a.m. (Singapore
time) on Thursday, April 26, 2007, or 8 p.m. (New York time) on Wednesday,
April 25, 2007 is +1-201-689-8560. A live webcast of the conference call
will be available on STATS ChipPAC's website at www.statschippac.com.
A replay of the call will be available 2 hours after the live call through
noon on Thursday, May 3, 2007 (in Singapore) or midnight on Wednesday, May
2, 2007 (in New York) at www.statschippac.com and by telephone at
+1-201-612-7415. The account number to access the replay is 3055 and the
conference ID number is 237457.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (NASDAQ : STTS ) and
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market and the Singapore Exchange
Securities Trading Limited. In addition, STATS ChipPAC is also included in
the Morgan Stanley Capital International (MSCI) Index and the Straits Times
Industrial Index. Further information is available at www.statschippac.com.
Information contained in this website does not constitute a part of this
release.
Forward Looking Statements
Certain statements in this release are forward-looking statements that
involve a number of risks and uncertainties that could cause actual events
or results to differ materially from those described in this release,
including statements relating to the effect, if any, that the letter
submitted to the SIC on behalf of Fore may have on any aspect of the Offer
or any matter relating to the Offer. Factors that could cause actual events
to differ from our expectations include actions that may be taken by the
Company, the Special Committee or third parties in connection with or in
response to the voluntary cash tender offer; general business and economic
conditions and the state of the semiconductor industry; level of
competition; demand for end-use applications products such as
communications equipment and personal computers; decisions by customers to
discontinue outsourcing of test and packaging services; reliance on a small
group of principal customers; continued success in technological
innovations; availability of financing; pricing pressures including
declines in average selling prices; tender offer by Singapore Technologies
Semiconductors Pte Ltd, a subsidiary of Temasek Holdings (Private) Limited
(Temasek Holdings); our substantial level of indebtedness; potential
impairment charges; adverse tax and other financial consequences if the
South Korean taxing authorities do not agree with our interpretation of the
applicable tax laws; ability to develop and protect our intellectual
property; rescheduling or canceling of customer orders; changes in products
mix; intellectual property rights disputes and litigation; capacity
utilization; delays in acquiring or installing new equipment; limitations
imposed by our financing arrangements which may limit our ability to
maintain and grow our business; changes in customer order patterns;
shortages in supply of key components; disruption of our operations; loss
of key management or other personnel; defects or malfunctions in our
testing equipment or packages; changes in environmental laws and
regulations; exchange rate fluctuations; regulatory approvals for further
investments in our subsidiaries; significant ownership by Temasek Holdings
that may result in conflicting interests with Temasek Holdings and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; our ability to successfully integrate the operations of
former STATS and ChipPAC and their employees; labor union problems in South
Korea; uncertainties of conducting business in China; natural calamities
and disasters, including outbreaks of epidemics and communicable diseases;
and other risks described from time to time in the Company's SEC filings,
including its annual report on Form 20-F dated March 12, 2007. We undertake
no obligation to publicly update or revise any forward-looking statements,
whether as a result of new information, future events or otherwise.