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STATS ChipPAC Announces Stacked Flip Chip Package for Mobile Platforms
3D Package Combines Baseband, Memory and Analog Functions in a Single Package for a High Performance, Cost Effective Solution
| Source: STATS ChipPAC
UNITED STATES--(Marketwire - June 18, 2007) - SINGAPORE -- 6/18/2007 -- STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company" (NASDAQ : STTS ) and (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, today announced a new stacked flip chip package which is designed
to integrate three key functions of a mobile communication device into a
single package.
Traditional applications for flip chip technology have been in high
performance ASICs and graphics. Yet, the inherent benefits of flip chip
technology such as high frequency operation, low parasitics, high
input/output (I/O) density and reduced package footprint are vital to the
growing demands placed on high end cellular handsets and mobile products.
STATS ChipPAC qualified and is ramping to production this new stacked flip
chip package which integrates multiple silicon functions with 600+
input/output (I/O) density into a Package-in-Package (PiP) configuration.
To achieve high I/O density and performance requirements, a baseband
Digital Signal Processor (DSP) is packaged as a flip chip device. The
memory device, which is in a pre-packaged, fully tested Internal Stacking
Module (ISM) format to ensure high yields, is stacked on the flip chip
device. The analog device is stacked on top of the ISM. The Flip Chip PiP
represents a packaging approach that combines several advanced technologies
such as bumped wafer thinning, thin die flip chip attach and low loop wire
bonding on the same substrate.
"Integrating the baseband, memory and analog functions within a single
package provides numerous advantages in speed, performance and
miniaturization. The challenge was to design a single package solution
which combined multiple package integration schemes within a very small
package to die ratio," said
Dr. Han Byung Joon, STATS ChipPAC's Executive Vice President and Chief
Technology Officer. "The Flip Chip PiP features innovations in substrates,
interconnection schemes, design methodologies and variations in package
architecture. These core technologies have a broad application potential
across a wide range of mobile products."
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" -- (NASDAQ : STTS ) and
(SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to the market faster. Our customers are some
of the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Colorado and North Carolina). Our offices outside the United States are
located in South Korea, Singapore, China, Malaysia, Taiwan, Japan, the
Netherlands and United Kingdom. STATS ChipPAC's facilities include those
of its subsidiary, Winstek Semiconductor Corporation, in Hsinchu District,
Taiwan. These facilities offer new product introduction support,
pre-production wafer sort, final test, packaging and other high volume
preparatory services. Together with our research and development centers in
South Korea, Singapore, Malaysia, China, Taiwan and the United States as
well as test facilities in the United States, this forms a global network
providing dedicated test engineering development and product engineering
support for customers from design to volume production. STATS ChipPAC is
listed on both the Nasdaq Stock Market (NASDAQ) and the Singapore Exchange
Securities Trading Limited (SGX-ST). In addition, STATS ChipPAC is also
included in the Morgan Stanley Capital International (MSCI) Index. Further
information is available at www.statschippac.com. Information contained in
this website does not constitute a part of this release.
Certain statements in this release, including statements regarding expected
future financial results and industry growth, are forward-looking
statements that involve a number of risks and uncertainties that could
cause actual events or results to differ materially from those described in
this release. Factors that could cause actual results to differ from our
expectations include, but are not limited to, general business and economic
conditions and the state of the semiconductor industry; level of
competition; demand for end-use applications products such as
communications equipment and personal computers; decisions by customers to
discontinue outsourcing of test and packaging services; reliance on a small
group of principal customers; continued success in technological
innovations; availability of financing; pricing pressures including
declines in average selling prices; ability to meet specific conditions
imposed for the continued trading or listing of the Company's securities on
the SGX-ST and the NASDAQ; our substantial level of indebtedness; potential
impairment charges; adverse tax and other financial consequences if the
South Korean taxing authorities do not agree with our interpretation of the
applicable tax laws; ability to develop and protect our intellectual
property; rescheduling or canceling of customer orders; changes in products
mix; intellectual property rights disputes and litigation; capacity
utilization; delays in acquiring or installing new equipment; limitations
imposed by our financing arrangements which may limit our ability to
maintain and grow our business; changes in customer order patterns;
shortages in supply of key components; disruption of our operations; loss
of key management or other personnel; defects or malfunctions in our
testing equipment or packages; changes in environmental laws and
regulations; exchange rate fluctuations; regulatory approvals for further
investments in our subsidiaries; significant ownership by Temasek Holdings
that may result in conflicting interests with Temasek Holdings and our
affiliates; unsuccessful acquisitions and investments in other companies
and businesses; our ability to continue to successfully integrate the
operations of the former separate STATS and ChipPAC companies and their
employees; labor union problems in South Korea; uncertainties of conducting
business in China; natural calamities and disasters, including outbreaks of
epidemics and communicable diseases; and other risks described from time to
time in the Company's SEC filings, including its annual report on Form 20-F
dated March 12, 2007. We undertake no obligation to publicly update or
revise any forward-looking statements, whether as a result of new
information, future events or otherwise.