BEVERLY, Mass., Oct. 15, 2009 (GLOBE NEWSWIRE) -- Axcelis Technologies, Inc. (Nasdaq:ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that a major foundry has selected the "single wafer" Optima XE for its most advanced production facility. The win follows an evaluation where the single wafer Optima XE demonstrated significant competitive advantages in productivity, cost of ownership and manufacturing flexibility. The Optima XE will be used for high volume manufacturing of a wide variety of logic and memory products, as well as for the development of next generation devices.
Mary Puma, chairman and CEO commented, "As foundries move to the sub 32nm era, they require systems that have a wide process envelope and exceptional performance while also providing the economic benefits that will propel them into a leading position. The Optima XE surpasses the competition in these areas, and we are excited about the potential as this new high energy customer adopts Axcelis' single wafer manufacturing technology."
The Optima XE combines Axcelis' production-proven RF Linac high energy, spot beam technology with a high-speed, state-of-the-art single wafer endstation, enabling unmatched productivity. Its inherent flexibility and broad energy range of 10keV to 4.5MeV allow a single tool to support chipmakers' dynamic high energy requirements for DRAM, NAND and NOR FLASH, embedded memory, image sensor and logic device manufacturing. Axcelis is the industry's foremost supplier of high energy ion implant systems, with the world's largest installed base and leading market share.
Axcelis Technologies, Inc. (Nasdaq:ACLS) headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. The company's Internet address is: www.axcelis.com.