3D-Printed Metals: A Patent Landscape Analysis Report 2016


Dublin, Aug. 16, 2016 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "3D-Printed Metals: A Patent Landscape Analysis - 2016 " report to their offering.

The report presents the quantitative patent landscape, which is essential to identifying the players, technologies, patent filing velocity, geographic distribution, and technology classifications in in the 3DP metals area.

Metals-based 3D printing is one of the fastest growing sectors of the 3D printing business. The author has already published widely on the growing market opportunities available in this space. Building on our extensive knowledge and understanding of this area we are now offering a report on the patent landscape presented by 3D-printed metals.

The processes covered in this report comprise: selective heat sintering/laser melting, stereololithography, fused deposition modeling, robocasting, electron beam manufacturing, ultrasonic consolidation, laser powder forming/laser engineered net shaping, direct metal laser sintering/melting, electron beam melting, powder bed, binder jetting, drop-on powder, etc.

This report has two components - (1) a 3d-printed patent database and (2) a granular analysis, commentary and guidance on the 3D printed patent environment by SmarTech's in-house IP attorney. This report will be required reading for IP professionals at firms supplying metals to the 3DP industry as well as those at 3D printing equipment and service companies. It is also aimed at patent attorneys, engineers, investment banks and others who need a comprehensive overview of 3D-printed metals activities.

The database provides a summary of all relevant patents with details of each patent including: patent/publication number, assignee, title, abstract, publication date, status of patent, PTO, priority country, priority years, and inventor. Also included will be technical categorization of filed patent applications and granted patents and an identification of patent /patent application families.

This report which is the only one of its kind covers both process and materials patents and answers such vital questions as:

- What patents have been granted and what patent applications have been filed?
- What are the top cited patents?
- How many patents are being filed each year?
- Who are the most significant inventors, researchers and companies active in the field
- Which companies are making the earliest patent grants?
- What patent families are already claimed and where are the gaps in the IP landscape where new IP rights may be available?
- What is the geographic distribution and technological class distribution of these patents?

Key Topics Covered:

Chapter One: Research Findings and Summary
1.1 Factors Influencing the Speed of Development of Metal-based Additive Manufacturing
1.2 Patent Search Methodology
1.2.1 Categorization and Terminology
1.2.2 Key Assignees
1.3 Concerning Metal Powder-based 3D Printing Systems
1.3.1 United Technologies Corporation
1.3.2 Arcam
1.3.3 EOS
1.3.4 General Electric
1.3.5 Panasonic/Matsushita
1.3.6 Materialise NV
1.3.7 Siemens
1.3.8 Honeywell
1.3.9 ConforMIS
1.3.10 Husky Injection Molding
1.3.11 Alstom
1.3.12 The ExOne Company

Chapter Two: Active Universities
2.1 Top Universities and Research Institutions

Chapter Three: Key Inventors
3.1 Top Inventors

Chapter Four: Patent Trend
4.1 Inferences: File Date Trends

Chapter Five: Key Patents Based on Forward Citation
5.1 Most Frequently Cited References

Chapter Six: Technology Analysis
6.1 U.S. Classification
6.1.1 Top Classification
6.1.2 Top Sub Classifications
6.2 Top IPC Classification
6.2.1 Top IPC Classifications
6.3 Technology Evolution
6.3.1 Inferences

Chapter Seven: Geographical Distribution

Chapter Eight: Granular Analysis
8.1 Inferences Related to Metal Powders
8.2 Inferences Related to Manufacturing Processes

Chapter Nine: White Space Analysis

Chapter Ten: Commentary and Guidance
10.1 Areas of Patent Saturation
10.2 Areas with Opportunities for Patent Growth
10.3 Key Areas for Patent Licensing

Companies Mentioned

- Alstom
- Arcam
- ConforMIS
- EOS
- General Electric
- Honeywell
- Husky Injection Molding
- Materialise NV
- Panasonic/Matsushita
- Siemens
- The ExOne Company
- United Technologies Corporation

For more information about this report visit http://www.researchandmarkets.com/research/xfzsxq/3dprinted

Related Topics: Metals and Minerals, Patents, 3D Printing



            

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