FREMONT, Calif., April 06, 2017 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received a production order of $850,000 for multiple Advanced Burn-in and Test System (ABTS) thermal chambers. This order is for an initial production run of systems for a potential high volume application and follows completion and acceptance of an initial ABTS chamber ordered and delivered to this new customer last year.
The order is part of a partnership agreement with this customer in which Aehr Test will deliver the critical thermal chamber subsystem for use with the customer’s own electronics and software for a custom application. Aehr Test expects to begin shipping the ABTS chambers on this order within the next quarter.
“We are excited about this new opportunity that is an interesting and new business model for Aehr Test,” said Gayn Erickson, President and CEO of Aehr Test Systems. “This customer selected Aehr Test due to our proprietary ABTS thermal chambers’ capability, including its power handling, temperature and air flow uniformity, and also our ability to supply hundreds of these ABTS chambers per year. We believe this project will drive significant revenue over our next two fiscal years.”
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-P families of test and burn-in systems and FOX WaferPak Aligner, FOX-XP WaferPak Contactor, and FOX DiePak® Carrier. The ABTS system is used in production and qualification testing of packaged parts for lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP system is a full wafer contact and singulated die/module test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test System’s website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Aehr Test as of the date hereof and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements include statements regarding expected shipping dates of our ABTS thermal chambers and uses of our ABTS thermal chambers. These risks and uncertainties include, without limitation, acceptance by customers of the ABTS thermal chambers, acceptance by customers of the ABTS thermal chambers shipped upon receipt of a purchase order and the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr Test’s ability to execute on its business strategy. See Aehr Test’s recent 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission for a more detailed description of the risks facing Aehr Test’s business. Aehr Test disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.