UFP Technologies Elects Cynthia Feldmann to its Board


NEWBURYPORT, Mass., June 09, 2017 (GLOBE NEWSWIRE) -- UFP Technologies, Inc. (Nasdaq:UFPT), an innovative designer and custom converter of foams, plastics, composites, and natural fiber materials, announced today that it has elected Cynthia Feldmann to its Board of Directors; she will also serve as Chair of the Audit Committee and member of the Nominating Committee. 

Ms. Feldmann has served for the past 12 years on the Board of Directors as well as the Audit Committee and Compliance Committee of STERIS PLC (NYSE:STE), a $2.6 billion provider of infection prevention, decontamination, and health science technologies products and services.  Since 2003, Ms. Feldmann has also served on the Board of Directors of Hanger Inc. (OTC:HNGR), a $1 billion provider of orthotic and prosthetic services and products, and has served on various committees of Hanger during her tenure, including the Audit and Compensation Committees as well as the Quality, Technology and Compliance Committee.  Previously, Ms. Feldmann served on the board of directors and various committees of several other companies and organizations, including Heartware International, Inc., Atrius Health, Hayes Lemmerz International, Inc., and Falmouth Academy.  Ms. Feldmann, a retired CPA, was previously a partner at KPMG LLP and Coopers & Lybrand.

“We are very pleased to have Cynthia join our Board of Directors,” said R. Jeffrey Bailly, Chairman and Chief Executive Officer.  “Her financial expertise, coupled with her extensive board and industry experience, will strengthen our Board and bring new perspectives to help us grow the company.”

UFP Technologies is an innovative designer and custom converter of foams, plastics, and natural fiber materials, principally serving the medical, automotive, consumer, electronics, industrial, and aerospace and defense markets. The UFP team acts as an extension of its customers’ in-house research, engineering, and manufacturing groups, working closely with them to solve their most complex product and packaging challenges.


            

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