LOUISVILLE, Colo., Feb. 13, 2019 (GLOBE NEWSWIRE) --
WHO: The 2019 Design and Verification Conference and Exhibition (DVCon) U.S. panel
WHAT: “Reshaping the Verification Landscape or Business as Usual?” will examine how AI and deep learning will reshape the verification landscape
WHEN: Wednesday, February 27, from 1:30 p.m. until 2:30 p.m.
WHERE: Oak/Fir Room, DoubleTree Hotel, San Jose, Calif.
The panel, moderated by Jean-Marie Brunet, senior director of marketing Emulation Division at Mentor, a Siemens Business, will outline challenges facing AI chip architects and verification engineers and determine whether machine learning approaches can be implemented in verification tools.
Panelists are:
Raymond Nijssen
Vice President and Chief Technologist
Achronix Semiconductor Corp.
Alex Starr
AMD Senior Fellow
AMD
Rob Aitken
Arm Research Fellow
Arm
Ty Garibay
Vice President of Hardware Engineering
Mythic
Saad Godil
Director of Applied Deep Learning Research
NVIDIA
For the complete DVCon U.S. 2019 schedule, including a list of tutorials, short workshops, panels, sponsored luncheons and events, visit https://dvcon.org/agenda. To view the videos from the DVCon U.S. 2018 Accellera Day tutorials, visit https://bit.ly/2Rv8ZNm
About DVCon
DVCon is the premier conference for discussion of the functional design and verification of electronic systems. DVCon is sponsored by Accellera Systems Initiative, an independent, not-for-profit organization dedicated to creating design and verification standards required by systems, semiconductor, intellectual property (IP) and electronic design automation (EDA) companies. In response to global interest, in addition to DVCon U.S., Accellera also sponsors events in China, Europe and India. For more information about Accellera, please visit www.accellera.org
Follow DVCon at:
Website: https://dvcon.org/
Twitter: @dvcon_us or #dvcon_us to comment
LinkedIn: https://www.linkedin.com/groups/8424092
Facebook: https://www.facebook.com/DvCon
For more information, contact:
Barbara Benjamin
HighPointe Communications
503-209-2323
barbara@hipcom.com