New York, NY, May 23, 2019 (GLOBE NEWSWIRE) -- Zion Market Research has published a new report titled “System In Package (SiP) Technology Market by Interconnection Technology (Wire Bond and Flip Chip), by Packaging Technology (2-D IC Packaging, 2.5-D IC Packaging, and 3-D IC Packaging), by Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense, and Others): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2018–2027”. According to the report, the global system in package (SiP) technology market was approximately USD 20,400 million in 2018 and is expected to generate around USD 41,850 million by 2027, at a CAGR of around 8.1% between 2019 and 2025.
The system in package (SiP) involves grouping of more than one circuit inside of single chip carrier system. The system in package technology ensures majority or all the functions of electronic systems are performed. This technology is generally used in digital music systems, mobile phones, etc.
Browse through 54 Tables & 23 Figures spread over 110 Pages and in-depth TOC on “Global System In Package (SiP) Technology Market: By Type, Size, Share, Technology, Trends. Segments, Analysis and Forecast, 2018–2027”.
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Rapidly growing portable electronics market, rising acceptance of Internet of Things (IoT), and increasing adoption of SiP technology in processors for real-world gaming and graphics cards are fuelling the use of SiP in automotive, consumer electronics, telecommunication, and other industrial sectors. Therefore, the global system in package (SiP) technology market is anticipated to witness notable growth in the future, owing to SiP’s enhanced durability and compact size. The growing demand for compact size and high-speed electronic products are driving the necessity of system in package technology.
The global system in package (SiP) technology market is fragmented on the basis of interconnection technology, packaging technology, and application. Based on interconnection technology, the market includes wire bond and flip chip. The flip chip segment is anticipated to show the highest CAGR in the future. For high-performance packages like graphics chipsets and PC, microprocessors, high-end application-specific ICs (ASICs), and high-speed memory, flip chip is the de-facto interconnection method.
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On the basis of packaging technology, the system in package (SiP) technology market includes 3-D IC packaging, 2.5-D IC packaging, and 2-D IC packaging. The 2.5-D IC packaging segment is expected to hold the maximum market share over the forecast time period. On the other hand, the 3-D IC Packaging technology segment is anticipated to grow at the highest CAGR in the years ahead.
Based on application, the system in package (SiP) technology market comprises the automotive, industrial system, telecommunication, consumer electronics, aerospace and defense, and others. The consumer electronics application segment is likely to contribute the largest market share in the future which would be followed by the telecommunication segment.
Browse the full “System In Package (SiP) Technology Market by Interconnection Technology (Wire Bond and Flip Chip), by Packaging Technology (2-D IC Packaging, 2.5-D IC Packaging, and 3-D IC Packaging), by Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense, and Others): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2018–2027”Report at https://www.zionmarketresearch.com/report/system-in-package-technology-market
By region, Asia Pacific held the dominant share of the global system in package (SiP) technology market in 2018 and is anticipated to continue its dominance over the forthcoming years as well. This regional growth can be attributed to developing countries like China and India, which contribute majorly to this regional market. Increasing technological adoption across the region, rising demand for semiconductors and portable devices, growing disposable income, and huge investments made in consumer electronics will further propel the region’s market in the future.
North America is anticipated to hold the second largest share of the global system in package (SiP) technology market, owing to the high technological penetration and the presence of major market players in the region. The well-established IT industry in the U.S. is significantly contributing toward the high share of the country in the regional system in package (SiP) technology market. Moreover, the huge consumer preference for technically-advanced interface software is also expected to propel this regional market in the future.
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Europe is anticipated to hold a significant share in the global system in package (SiP) technology market in the years ahead. UK and Germany are expected to dominate the European system in package (SiP) technology market, owing to the rapidly developing technologies and increasing acceptance of these advanced technologies by the regional population.
Latin American and the Middle Eastern and African regions are likely to show the slowest market, due to the low penetration of advanced technologies and services, lack of skilled personnel, and slow adoption of the system in package (SiP) technology. In Latin America, Brazil dominates the system in package (SiP) technology market, owing to the rising adoption and awareness about progressive and technologically advanced products.
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Some key players operating in the global system in package (sip) technology market are Toshiba, Fujitsu, Renesas Electronics, Samsung, Amkor, ASE Group, Chipmos Technologies, Jiangsu Changjiang Electronics, and Powertech Technology.
This report segments the global system in package (SiP) technology market into:
Global System in Package (SiP) Technology Market: Interconnection Technology Analysis
- Wire Bond
- Flip Chip
Global System in Package (SiP) Technology Market: Packaging Technology Analysis
- 2-D IC Packaging
- 2.5-D IC Packaging
- 3-D IC Packaging
Global System in Package (SiP) Technology Market: Application Analysis
- Consumer Electronics
- Aerospace and Defense
- Automotive
- Telecommunication
- Industrial System
- Others
Global System in Package (SiP) Technology Market: Regional Analysis
- North America
- The U.S.
- Europe
- UK
- France
- Germany
- Asia Pacific
- China
- Japan
- India
- Latin America
- Brazil
- The Middle East and Africa
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