ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics เปิดตัว Industrial 176-Layer PCIe® Gen 4 x4 M.2, U.2 SSD ที่นำเสนอประสิทธิภาพ R/W ที่ยอดเยี่ยมพร้อมความจุสูงสุด 7.68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics ผู้นำระดับโลกด้านโซลูชั่นการจัดเก็บข้อมูลและหน่วยความจำเฉพาะทาง เปิดตัวอุปกรณ์จัดเก็บข้อมูล N600 Series M.2 2280 และ U.2 solid...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics lanza SSDs 176-Layer PCIe® Gen 4 x4 M.2, U.2 industriales que ofrecen excelente rendimiento R/W y máxima capacidad de 7.68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPÉI, Taiwán, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, el líder mundial en soluciones especializadas de almacenamiento y memoria, presenta sus más recientes unidades de...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics lance les disques SSD industriels 176 couches PCIe® Gén. 4 x4 U.2 et M.2 qui offrent d'excellentes performance en lecture/écriture et une capacité pouvant aller jusqu'à 7,68 To
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 28 juin 2023 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions de stockage et de mémoire spécialisées, lance ses tout derniers disques SSD U.2 et M.2 2280 à...
Global DRAM Module and Components Market
DRAM Module and Component Market by Type, End-user Industries, Memory and Geography - Global Forecast to 2027
May 09, 2022 07:03 ET | Research and Markets
Dublin, May 09, 2022 (GLOBE NEWSWIRE) -- The "DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer...
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
March 18, 2022 11:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 18, 2022 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest line of M.2 2280 NVMe solid state drives...
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Flash and XPoint Memory Applications and Market Forecasts to 2026 - End-use Markets, Shipments, Market Shares by Vendor, and More
September 30, 2021 05:23 ET | Research and Markets
Dublin, Sept. 30, 2021 (GLOBE NEWSWIRE) -- The "Flash and XPoint Memory Applications and Markets: 2019-2026" report has been added to ResearchAndMarkets.com's offering. Flash and XPoint memory...
ATP Electronics Thermal Management Memory Solution
ATP最大3.48/8TBのストレージを備えたNVMe M.2/U.2 SSD用の銅箔、フィンタイプ・ヒートシンク/サーマルパッドを発表
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台湾・台北, March 29, 2021 (GLOBE NEWSWIRE) -- 台湾・台北(2021年3月) – 特殊ストレージとメモリ・ソリューションの世界的リーダーであるATP Electronicsは、カスタマイズ可能な熱管理機能を備えた新しいNVMe Flashストレージ・ソリューションの発売を発表しました。...
ATP Electronics Thermal Management Memory Solution
ATP華騰國際發表高容量儲存記憶體 3.84及8 TB銅箔與鰭狀散熱片式NVMe M.2/U.2 固態硬碟
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台灣台北, March 29, 2021 (GLOBE NEWSWIRE) -- 專注於儲存與記體體解決方案的領導廠商華騰國際科技(ATP Electronics)新發表客製化熱管理NVMe快閃記憶體解決方案。運用硬體與韌體配置,強化記憶體熱管理解決方案,特別針對NVMe介面的固態硬碟(Solid State Drives,...
ATP Electronics Thermal Management Memory Solution
ATP présente le dissipateur thermique/tampon thermique à ailettes et feuille de cuivre pour les cartes SSD NVMe M.2/U.2 offrant jusqu'à 3,84/8 To de stockage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 29 mars 2021 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions spécialisées de stockage et de mémoire, a annoncé le lancement de ses nouvelles solutions de...
ATP Electronics Thermal Management Memory Solution
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with...